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    Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

    New search for: Liu, C.
    New search for: Chen, J.
    New search for: Liu, P. L.
    New search for: Shang, J.

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    Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

    New search for: Liu, C.
    New search for: Chen, J.
    New search for: Liu, P. L.
    New search for: Shang, J.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

    New search for: Liu, C.
    New search for: Chen, J.
    New search for: Liu, P. L.
    New search for: Shang, J.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Access

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    Document information
    Title:

    Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoindentation

    Contributors:

    Liu, C. ( author ) / Chen, J. ( author ) / Liu, P. L. ( author ) / Shang, J. ( author )

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 22 ; 130-134

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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