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Diode laser soldering using a lead-free filler material for electronic packaging structures

Chaminade, C. / Fogarassy, E. / Boisselier, D.

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Diode laser soldering using a lead-free filler material for electronic packaging structures

Chaminade, C. / Fogarassy, E. / Boisselier, D.

Diode laser soldering using a lead-free filler material for electronic packaging structures

Chaminade, C. / Fogarassy, E. / Boisselier, D.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Diode laser soldering using a lead-free filler material for electronic packaging structures

Contributors:

Chaminade, C. (author) / Fogarassy, E. (author) / Boisselier, D. (author)

Published in:

APPLIED SURFACE SCIENCE ; 252 ; 4406-4410

Publication date:

2006-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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