Solidification behavior of Al–20.6%Cu alloy under AC magnetic field: Fid-Bau Portal

Solidification behavior of Al–20.6%Cu alloy under AC magnetic field

Ban, C. / Cui, J. / Han, Y. / Ba, Q.

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Solidification behavior of Al–20.6%Cu alloy under AC magnetic field

Ban, C. / Cui, J. / Han, Y. / Ba, Q.

Solidification behavior of Al–20.6%Cu alloy under AC magnetic field

Ban, C. / Cui, J. / Han, Y. / Ba, Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Solidification behavior of Al–20.6%Cu alloy under AC magnetic field

Contributors:

Ban, C. (author) / Cui, J. (author) / Han, Y. (author) / Ba, Q. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 41 ; 3113-3115

Publication date:

2006-01-01

Size:

3 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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