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Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding

Lee, S. H. / Han, S. Z. / Lim, C. Y.

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Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding

Lee, S. H. / Han, S. Z. / Lim, C. Y.

Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding

Lee, S. H. / Han, S. Z. / Lim, C. Y.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding

Contributors:

Lee, S. H. (author) / Han, S. Z. (author) / Lim, C. Y. (author)

Published in:

KEY ENGINEERING MATERIALS ; 317/318 ; 239-242

Publication date:

2006-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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