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Bonding at copper–alumina interfaces established by different surface treatments: a critical review
Bonding at copper–alumina interfaces established by different surface treatments: a critical review
Bonding at copper–alumina interfaces established by different surface treatments: a critical review
JOURNAL OF MATERIALS SCIENCE ; 41 ; 5161-5168
2006-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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