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Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates
Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates
Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates
Lee, J. W. (author) / Lee, I. S. (author) / Kang, T. W. (author) / Kim, D. W. (author) / Kim, S. H. (author) / Lee, S.-S. / Lee, J. H. / Park, I. K. / Song, S.-J. / Choi, M. Y.
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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