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Reliability Estimation of Solder Joint by Using the Failure Probability Models

Lee, O. S. / Hur, M. J. / Hawong, J. S. / Myoung, N. H. / Kim, D. H.

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Reliability Estimation of Solder Joint by Using the Failure Probability Models

Lee, O. S. / Hur, M. J. / Hawong, J. S. / Myoung, N. H. / Kim, D. H.

Reliability Estimation of Solder Joint by Using the Failure Probability Models

Lee, O. S. / Hur, M. J. / Hawong, J. S. / Myoung, N. H. / Kim, D. H.

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Check availability in my library

Order at Subito €

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Document information

Title:

Reliability Estimation of Solder Joint by Using the Failure Probability Models

Contributors:

Lee, O. S. (author) / Hur, M. J. (author) / Hawong, J. S. (author) / Myoung, N. H. (author) / Kim, D. H. (author) / Lee, S.-B. / Kim, Y.-J.

Published in:

Experimental Mechanics in Nano and Biotechnology ; 621-624

KEY ENGINEERING MATERIALS ; 326/328

Publication date:

2006-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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