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    Solder Joint Reliability of High-end FCSiP

    New search for: Kim, S.H.
    New search for: Park, H.
    New search for: Kakegawa, C.
    New search for: Tabuchi, H.
    New search for: Kajihara, M.

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    Solder Joint Reliability of High-end FCSiP

    New search for: Kim, S.H.
    New search for: Park, H.
    New search for: Kakegawa, C.
    New search for: Tabuchi, H.
    New search for: Kajihara, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Solder Joint Reliability of High-end FCSiP

    New search for: Kim, S.H.
    New search for: Park, H.
    New search for: Kakegawa, C.
    New search for: Tabuchi, H.
    New search for: Kajihara, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Solder Joint Reliability of High-end FCSiP

    Contributors:

    Kim, S.H. (author) / Park, H. (author) / Kakegawa, C. (author) / Tabuchi, H. (author) / Kajihara, M. (author)

    Published in:

    ADVANCED PACKAGING ; 17 ; 24-27

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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