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Improving electroless Cu via filling with optimized Pd activation

Lau, P. P. / Wong, C. C. / Chan, L.

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Improving electroless Cu via filling with optimized Pd activation

Lau, P. P. / Wong, C. C. / Chan, L.

Improving electroless Cu via filling with optimized Pd activation

Lau, P. P. / Wong, C. C. / Chan, L.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Similar titles

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Document information

Title:

Improving electroless Cu via filling with optimized Pd activation

Contributors:

Lau, P. P. (author) / Wong, C. C. (author) / Chan, L. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 2357-2361

Publication date:

2006-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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