On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material: Fid-Bau Portal

On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material

Wei, X. / Huang, H. / Zhou, L. / Zhang, M. / Liu, X.

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On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material

Wei, X. / Huang, H. / Zhou, L. / Zhang, M. / Liu, X.

On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material

Wei, X. / Huang, H. / Zhou, L. / Zhang, M. / Liu, X.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material

Contributors:

Wei, X. (author) / Huang, H. (author) / Zhou, L. (author) / Zhang, M. (author) / Liu, X. (author)

Published in:

MATERIALS LETTERS ; 61 ; 655-658

Publication date:

2007-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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Enhancing mechanical response of hypoeutectic Sn-6.5Zn solder alloy using Ni and Sb additions

El-Daly, A. A. / Hammad, A. E. / Al-Ganainy, G. A. et al. | British Library Online Contents | 2013

Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions

El-Daly, A.A. / Hammad, A.E. / Al-Ganainy, G.A. et al. | British Library Online Contents | 2013