Material developed for lead-free solder: Fid-Bau Portal

Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

Material developed for lead-free solder

Access

Check availability in my library

Order at Subito €

Page navigation

Document information

Export, share and cite

Material developed for lead-free solder

Material developed for lead-free solder

Access

Check availability in my library

Order at Subito €

Page navigation

Document information

Export, share and cite

Document information

Title:

Material developed for lead-free solder

Published in:

REINFORCED PLASTICS -LONDON- ; 48 ; 21

Publication date:

2004-01-01

Size:

21 pages

ISSN:

Type of media:

Article (Journal)

Type of material:

Print

Language:

English

Classification:

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

Similar titles

Lead-free Solder Wafer Bumping

Dimock, F. / Mattson, K. | British Library Online Contents | 2004

Thermomigration in lead-free solder joints

Abdulhamid, M.F. / Li, S. / Basaran, C. | British Library Online Contents | 2008

Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal | British Library Online Contents | 2008

Effective diffusivity of lead free solder alloys

Li, S. / Basaran, C. | British Library Online Contents | 2009

Liquidus Temperature Design of Lead-Free Solder

Suetsugu, K. / Furusawa, A. / Tanaka, M. et al. | British Library Online Contents | 2006