Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag

    New search for: Yen, Y.-W.
    New search for: Jao, C.-C.
    New search for: Lee, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag

    New search for: Yen, Y.-W.
    New search for: Jao, C.-C.
    New search for: Lee, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag

    New search for: Yen, Y.-W.
    New search for: Jao, C.-C.
    New search for: Lee, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag

    Contributors:

    Yen, Y.-W. (author) / Jao, C.-C. (author) / Lee, C. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 2986-2990

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition

    Watanabe, H. / Shimoda, M. / Hidaka, N. et al. | British Library Online Contents | 2011

    Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

    Mokhtari, Omid / Zhou, Shiqi / Chan, Y. C. et al. | British Library Online Contents | 2016

    Interfacial Reaction between Sn-Ag-Co Solder and Metals

    Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2005

    Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

    Hu, F.Q. / Zhang, Q.K. / Jiang, J.J. et al. | British Library Online Contents | 2018

    Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

    Yen, Y.-w. / Liou, W.-k. | British Library Online Contents | 2007

    Back to top