Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate: Fid-Bau Portal

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Yen, Y.-w. / Liou, W.-k.

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Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Yen, Y.-w. / Liou, W.-k.

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Yen, Y.-w. / Liou, W.-k.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Contributors:

Yen, Y.-w. (author) / Liou, W.-k. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 2663-2667

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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