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    Modeling of Laser Dressing for Metal-Bond Diamond Grinding Wheel

    New search for: Wang, X. Y.
    New search for: Kang, R. K.
    New search for: Xu, W. J.
    New search for: Wang, L. J.
    New search for: Guo, D. M.
    New search for: Guo, D.
    New search for: Kuriyagawa, T.
    New search for: Wang, J.
    New search for: Tamaki, J.

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    Modeling of Laser Dressing for Metal-Bond Diamond Grinding Wheel

    New search for: Wang, X. Y.
    New search for: Kang, R. K.
    New search for: Xu, W. J.
    New search for: Wang, L. J.
    New search for: Guo, D. M.
    New search for: Guo, D.
    New search for: Kuriyagawa, T.
    New search for: Wang, J.
    New search for: Tamaki, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Modeling of Laser Dressing for Metal-Bond Diamond Grinding Wheel

    New search for: Wang, X. Y.
    New search for: Kang, R. K.
    New search for: Xu, W. J.
    New search for: Wang, L. J.
    New search for: Guo, D. M.
    New search for: Guo, D.
    New search for: Kuriyagawa, T.
    New search for: Wang, J.
    New search for: Tamaki, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
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    Document information
    Title:

    Modeling of Laser Dressing for Metal-Bond Diamond Grinding Wheel

    Contributors:

    Wang, X. Y. (author) / Kang, R. K. (author) / Xu, W. J. (author) / Wang, L. J. (author) / Guo, D. M. (author) / Guo, D. / Kuriyagawa, T. / Wang, J. / Tamaki, J.

    Published in:

    Advances in Abrasive Technology IX ; 145-150

    KEY ENGINEERING MATERIALS ; 329

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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