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Aging process optimization for a copper alloy considering hardness and electrical conductivity

Su, J. h. / Li, H. j. / Liu, P. / Dong, Q. m. / Li, A. j.

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Aging process optimization for a copper alloy considering hardness and electrical conductivity

Su, J. h. / Li, H. j. / Liu, P. / Dong, Q. m. / Li, A. j.

Aging process optimization for a copper alloy considering hardness and electrical conductivity

Su, J. h. / Li, H. j. / Liu, P. / Dong, Q. m. / Li, A. j.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Aging process optimization for a copper alloy considering hardness and electrical conductivity

Contributors:

Su, J. h. (author) / Li, H. j. (author) / Liu, P. (author) / Dong, Q. m. (author) / Li, A. j. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 38 ; 697-701

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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