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    New Alkaline Copper Electroplating Bath Based on an Inorganic Complexing Agent

    New search for: Rafizadeh, M.
    New search for: Bahmani, M.
    New search for: Chelaras, R. T.

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    New Alkaline Copper Electroplating Bath Based on an Inorganic Complexing Agent

    New search for: Rafizadeh, M.
    New search for: Bahmani, M.
    New search for: Chelaras, R. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    New Alkaline Copper Electroplating Bath Based on an Inorganic Complexing Agent

    New search for: Rafizadeh, M.
    New search for: Bahmani, M.
    New search for: Chelaras, R. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    New Alkaline Copper Electroplating Bath Based on an Inorganic Complexing Agent

    Contributors:

    Rafizadeh, M. (author) / Bahmani, M. (author) / Chelaras, R. T. (author)

    Published in:

    PORTUGALIAE ELECTROCHIMICA ACTA ; 24 ; 387-392

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    0872-1904

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  541.37

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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