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    Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent

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    Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent

    New search for: Feng, S.-b.
    New search for: Su, C.
    New search for: Cheng, S.
    New search for: Li, H.-d.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent

    New search for: Feng, S.-b.
    New search for: Su, C.
    New search for: Cheng, S.
    New search for: Li, H.-d.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent

    Contributors:

    Feng, S.-b. (author) / Su, C. (author) / Cheng, S. (author) / Li, H.-d. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 44 ; 34-37

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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