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    A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

    New search for: Ju, B. F.
    New search for: Liu, K. K.
    New search for: Wong, M. F.
    New search for: Wan, K. T.

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    A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

    New search for: Ju, B. F.
    New search for: Liu, K. K.
    New search for: Wong, M. F.
    New search for: Wan, K. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

    New search for: Ju, B. F.
    New search for: Liu, K. K.
    New search for: Wong, M. F.
    New search for: Wan, K. T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

    Contributors:

    Ju, B. F. (author) / Liu, K. K. (author) / Wong, M. F. (author) / Wan, K. T. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 74 ; 1101-1106

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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