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    Process of Coarsening Pretreatment of Epoxy - Resin Packaging Material for Electroless Copper Plating

    New search for: Wu, X.-e.
    New search for: Hu, M.
    New search for: Tian, B.
    New search for: Shen, L.-z.

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    Process of Coarsening Pretreatment of Epoxy - Resin Packaging Material for Electroless Copper Plating

    New search for: Wu, X.-e.
    New search for: Hu, M.
    New search for: Tian, B.
    New search for: Shen, L.-z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Process of Coarsening Pretreatment of Epoxy - Resin Packaging Material for Electroless Copper Plating

    New search for: Wu, X.-e.
    New search for: Hu, M.
    New search for: Tian, B.
    New search for: Shen, L.-z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Process of Coarsening Pretreatment of Epoxy - Resin Packaging Material for Electroless Copper Plating

    Contributors:

    Wu, X.-e. (author) / Hu, M. (author) / Tian, B. (author) / Shen, L.-z. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 39 ; 19-22

    Publication date:

    2006-01-01

    Size:

    4 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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