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    Crack Healing, Reopening and Thermal Expansion Behavior of Al~2TiO~5 Ceramics at High Temperature

    New search for: Kim, I. J.
    New search for: Lee, K. S.
    New search for: Aneziris, C. G.
    New search for: Pan, W.
    New search for: Gong, J.

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    Crack Healing, Reopening and Thermal Expansion Behavior of Al~2TiO~5 Ceramics at High Temperature

    New search for: Kim, I. J.
    New search for: Lee, K. S.
    New search for: Aneziris, C. G.
    New search for: Pan, W.
    New search for: Gong, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Crack Healing, Reopening and Thermal Expansion Behavior of Al~2TiO~5 Ceramics at High Temperature

    New search for: Kim, I. J.
    New search for: Lee, K. S.
    New search for: Aneziris, C. G.
    New search for: Pan, W.
    New search for: Gong, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Crack Healing, Reopening and Thermal Expansion Behavior of Al~2TiO~5 Ceramics at High Temperature

    Contributors:

    Kim, I. J. (author) / Lee, K. S. (author) / Aneziris, C. G. (author) / Pan, W. / Gong, J.

    Published in:

    Proceedings of the Fourth China International Conference on High-Performance Ceramics (CICC-4) (Incorporating the Second International Workshop on Layered and Graded Materials and the First Satellite Symposium on Thermoelectrics) Chengdu, China, October 23 ∼ 26, 2005 ; 2448-2450

    KEY ENGINEERING MATERIALS ; 336/338

    Publication date:

    2007-01-01

    Size:

    3 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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