Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder

    New search for: Hsuan, T. C.
    New search for: Lin, K. L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder

    New search for: Hsuan, T. C.
    New search for: Lin, K. L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder

    New search for: Hsuan, T. C.
    New search for: Lin, K. L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder

    Contributors:

    Hsuan, T. C. (author) / Lin, K. L. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 456 ; 202-209

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    Hammad, A. E. | British Library Online Contents | 2013

    Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

    Hammad, A.E. | Elsevier | 2013

    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    Hammad, A. E. | British Library Online Contents | 2013

    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    Hammad, A. E. | British Library Online Contents | 2013

    Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni

    Hammad, A.E. | Elsevier | 2013

    Back to top