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Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications
Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications
Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications
Hammad, A. E. (author)
MATERIALS AND DESIGN -REIGATE- ; 52 ; 663-670
2013-01-01
8 pages
Article (Journal)
English
DDC:
620.0042
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British Library Online Contents | 2013
|British Library Online Contents | 2013
|British Library Online Contents | 2013
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