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    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    New search for: Hammad, A. E.

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    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    New search for: Hammad, A. E.

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    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    New search for: Hammad, A. E.

    Access

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    Document information
    Title:

    Evolution of microstructure, thermal and creep properties of Ni-doped Sn-0.5Ag-0.7Cu low-Ag solder alloys for electronic applications

    Contributors:

    Hammad, A. E. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 52 ; 663-670

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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