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Molecular Dynamics Analysis for Deformation and Fracture Behavior of Copper Thin Films
Molecular Dynamics Analysis for Deformation and Fracture Behavior of Copper Thin Films
Molecular Dynamics Analysis for Deformation and Fracture Behavior of Copper Thin Films
Fujii, T. (author) / Akiniwa, Y. (author)
KEY ENGINEERING MATERIALS ; 340/341 ; 979-984
2007-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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