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    Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films

    New search for: Gan, Y. X.
    New search for: Wei, C. S.
    New search for: Lam, M.
    New search for: Wei, X.
    New search for: Lee, D.
    New search for: Kysar, J. W.
    New search for: Chen, X.

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    Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films

    New search for: Gan, Y. X.
    New search for: Wei, C. S.
    New search for: Lam, M.
    New search for: Wei, X.
    New search for: Lee, D.
    New search for: Kysar, J. W.
    New search for: Chen, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films

    New search for: Gan, Y. X.
    New search for: Wei, C. S.
    New search for: Lam, M.
    New search for: Wei, X.
    New search for: Lee, D.
    New search for: Kysar, J. W.
    New search for: Chen, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films

    Contributors:

    Gan, Y. X. (author) / Wei, C. S. (author) / Lam, M. (author) / Wei, X. (author) / Lee, D. (author) / Kysar, J. W. (author) / Chen, X. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 42 ; 5256-5263

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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