Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition: Fid-Bau Portal

Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition

Kim, J. S. / Choi, W. S. / Kim, D. / Shkel, A. / Lee, C. C.

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Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition

Kim, J. S. / Choi, W. S. / Kim, D. / Shkel, A. / Lee, C. C.

Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition

Kim, J. S. / Choi, W. S. / Kim, D. / Shkel, A. / Lee, C. C.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition

Contributors:

Kim, J. S. (author) / Choi, W. S. (author) / Kim, D. (author) / Shkel, A. (author) / Lee, C. C. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 458 ; 101-107

Publication date:

2007-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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