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A platform for research: civil engineering, architecture and urbanism
Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys
Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys
Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys
Kim, J. S. (author) / Yokozuka, T. (author) / Lee, C. C. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 458 ; 116-122
2007-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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