Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Handling Ultra-thin Wafers: Mobile Electrostatic Carriers Enable Bumping

    New search for: Landesberger, C.
    New search for: Scherbaum, S.
    New search for: Bollman, D.
    New search for: Bock, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Handling Ultra-thin Wafers: Mobile Electrostatic Carriers Enable Bumping

    New search for: Landesberger, C.
    New search for: Scherbaum, S.
    New search for: Bollman, D.
    New search for: Bock, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Handling Ultra-thin Wafers: Mobile Electrostatic Carriers Enable Bumping

    New search for: Landesberger, C.
    New search for: Scherbaum, S.
    New search for: Bollman, D.
    New search for: Bock, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Handling Ultra-thin Wafers: Mobile Electrostatic Carriers Enable Bumping

    Contributors:

    Landesberger, C. (author) / Scherbaum, S. (author) / Bollman, D. (author) / Bock, K. (author)

    Published in:

    ADVANCED PACKAGING ; 16 ; 32-35

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Indicators- Bumping up

    Online Contents | 1994

    Rapid handling construction method for bumping phenomenon at bridge expansion joint position

    YUAN HANGXIN / DONG HAIDONG / LIANG JUNWEI et al. | European Patent Office | 2023

    Free access

    Wafer Thinning Techniques for Ultra-thin Wafers

    Reiche, M. / Wagner, G. | British Library Online Contents | 2003

    Lead-free Solder Wafer Bumping

    Dimock, F. / Mattson, K. | British Library Online Contents | 2004

    Wafer Bumping An Industry Perspective

    Buchanan, E. | British Library Online Contents | 2004

    Back to top