Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes: Fid-Bau Portal

Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes

Kim, T. H. / Lee, S. Y. / Lee, J. S. / Suh, D. I. / Cho, N. K. / Bahng, W. / Kim, N. K. / Choi, S. Y. / Kim, H. J. / Lee, S. K.

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Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes

Kim, T. H. / Lee, S. Y. / Lee, J. S. / Suh, D. I. / Cho, N. K. / Bahng, W. / Kim, N. K. / Choi, S. Y. / Kim, H. J. / Lee, S. K.

Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes

Kim, T. H. / Lee, S. Y. / Lee, J. S. / Suh, D. I. / Cho, N. K. / Bahng, W. / Kim, N. K. / Choi, S. Y. / Kim, H. J. / Lee, S. K.

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Document information

Title:

Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes

Contributors:

Kim, T. H. (author) / Lee, S. Y. (author) / Lee, J. S. (author) / Suh, D. I. (author) / Cho, N. K. (author) / Bahng, W. (author) / Kim, N. K. (author) / Choi, S. Y. (author) / Kim, H. J. (author) / Lee, S. K. (author)

Published in:

Silicon Carbide and Related Materials 2006 ; 717-720

MATERIALS SCIENCE FORUM ; 556/557

Publication date:

2007-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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