Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Analysis of Novel Packaging Techniques for High Power Electronics in SiC

    New search for: Rashid, S. J.
    New search for: Johnson, C. M.
    New search for: Udrea, F.
    New search for: Mihaila, A.
    New search for: Amaratunga, G.
    New search for: Malhan, R. K.
    New search for: Wright, N.
    New search for: Johnson, C. M.
    New search for: Vassilevski, K.
    New search for: Nikitina, I.
    New search for: Horsfall, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Analysis of Novel Packaging Techniques for High Power Electronics in SiC

    New search for: Rashid, S. J.
    New search for: Johnson, C. M.
    New search for: Udrea, F.
    New search for: Mihaila, A.
    New search for: Amaratunga, G.
    New search for: Malhan, R. K.
    New search for: Wright, N.
    New search for: Johnson, C. M.
    New search for: Vassilevski, K.
    New search for: Nikitina, I.
    New search for: Horsfall, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis of Novel Packaging Techniques for High Power Electronics in SiC

    New search for: Rashid, S. J.
    New search for: Johnson, C. M.
    New search for: Udrea, F.
    New search for: Mihaila, A.
    New search for: Amaratunga, G.
    New search for: Malhan, R. K.
    New search for: Wright, N.
    New search for: Johnson, C. M.
    New search for: Vassilevski, K.
    New search for: Nikitina, I.
    New search for: Horsfall, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Analysis of Novel Packaging Techniques for High Power Electronics in SiC

    Contributors:

    Rashid, S. J. (author) / Johnson, C. M. (author) / Udrea, F. (author) / Mihaila, A. (author) / Amaratunga, G. (author) / Malhan, R. K. (author) / Wright, N. / Johnson, C. M. / Vassilevski, K. / Nikitina, I.

    Published in:

    Silicon Carbide and Related Materials 2006 ; 971-974

    MATERIALS SCIENCE FORUM ; 556/557

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    High-Performance Packaging of Power Electronics

    Shaw, M. C. | British Library Online Contents | 2003

    A High Performance Polymer Thin Film Power Electronics Packaging Technology

    Fillion, R. / Delgado, E. / McConnelee, P. et al. | British Library Online Contents | 2003

    Probabilistic Fatigue Life Analysis of High Density Electronics Packaging

    Moore, N. R. / Kolawa, E. A. / Sutharshana, S. et al. | British Library Conference Proceedings | 1996

    Moisture in Electronics Packaging

    Donahoe, D.N. / Poliskie, G.M. | British Library Online Contents | 2011

    Nanopackaging : Nanotechnologies and Electronics Packaging

    Morris, James E. | UB Braunschweig | 2018

    Back to top