Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    A High Performance Polymer Thin Film Power Electronics Packaging Technology

    New search for: Fillion, R.
    New search for: Delgado, E.
    New search for: McConnelee, P.
    New search for: Beaupre, R.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    A High Performance Polymer Thin Film Power Electronics Packaging Technology

    New search for: Fillion, R.
    New search for: Delgado, E.
    New search for: McConnelee, P.
    New search for: Beaupre, R.

    Access

    Access via TIB
    Check availability in my library

    A High Performance Polymer Thin Film Power Electronics Packaging Technology

    New search for: Fillion, R.
    New search for: Delgado, E.
    New search for: McConnelee, P.
    New search for: Beaupre, R.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A High Performance Polymer Thin Film Power Electronics Packaging Technology

    Contributors:

    Fillion, R. (author) / Delgado, E. (author) / McConnelee, P. (author) / Beaupre, R. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 30 ; 7-12

    Publication date:

    2003-01-01

    Size:

    6 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    High-Performance Packaging of Power Electronics

    Shaw, M. C. | British Library Online Contents | 2003

    Recyclable Thin‐Film Soft Electronics for Smart Packaging and E‐Skins

    Reis Carneiro, Manuel / de Almeida, Aníbal T. / Tavakoli, Mahmoud et al. | Wiley | 2023

    Free access

    Recyclable Thin‐Film Soft Electronics for Smart Packaging and E‐Skins

    Reis Carneiro, Manuel / de Almeida, Aníbal T. / Tavakoli, Mahmoud et al. | Wiley | 2023

    Free access

    Next-generation Electronics Packaging Using Flip Chip Technology

    Pascariu, G. / Cronin, P. / Crowley, D. | British Library Online Contents | 2003

    Analysis of Novel Packaging Techniques for High Power Electronics in SiC

    Rashid, S. J. / Johnson, C. M. / Udrea, F. et al. | British Library Online Contents | 2007

    Back to top