Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding: Fid-Bau Portal

Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Takata, N. / Yamada, K. / Ikeda, K.-i. / Yoshida, F. / Nakashima, H. / Tsuji, N.

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Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Takata, N. / Yamada, K. / Ikeda, K.-i. / Yoshida, F. / Nakashima, H. / Tsuji, N.

Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Takata, N. / Yamada, K. / Ikeda, K.-i. / Yoshida, F. / Nakashima, H. / Tsuji, N.

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Title:

Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Contributors:

Takata, N. (author) / Yamada, K. (author) / Ikeda, K.-i. (author) / Yoshida, F. (author) / Nakashima, H. (author) / Tsuji, N. (author)

Published in:

Crystallographic Orientation Distribution and Related Properties in Advanced Materials ; 2043-2048

MATERIALS TRANSACTIONS ; 48

Publication date:

2007-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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