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    Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

    New search for: Miyajima, Yoji
    New search for: Uchiyama, Midori
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

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    Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

    New search for: Miyajima, Yoji
    New search for: Uchiyama, Midori
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

    New search for: Miyajima, Yoji
    New search for: Uchiyama, Midori
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

    Contributors:

    Miyajima, Yoji (author) / Uchiyama, Midori (author) / Adachi, Hiroki (author) / Fujii, Toshiyuki (author) / Onaka, Susumu (author) / Kato, Masaharu (author)

    Published in:

    Materials transactions ; 57 ; 1411-1417

    Publication date:

    2016-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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