A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Ji, E. S. (author) / Kim, Y. H. (author) / Kang, Y. C. (author) / Kang, Y. S. (author) / Ahn, B. H. (author)
SURFACE REVIEW AND LETTERS ; 14 ; 593-596
2007-01-01
4 pages
Article (Journal)
English
DDC:
530.417
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Copper circuit patterning on polymer using selective surface modification and electroless plating
| British Library Online Contents | 2017
Copper circuit patterning on polymer using selective surface modification and electroless plating
| British Library Online Contents | 2017
Copper circuit patterning on polymer using selective surface modification and electroless plating
| British Library Online Contents | 2017
Electroless Copper Plating on Molybdenum Powder Surface
| British Library Online Contents | 2008
Electroless Copper Plating Technology for Graphite Powder
| British Library Online Contents | 2004