Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Plating of Copper Layers on Polyimides Using Electroless Plating by Surface Modification
Ji, E. S. (Autor:in) / Kim, Y. H. (Autor:in) / Kang, Y. C. (Autor:in) / Kang, Y. S. (Autor:in) / Ahn, B. H. (Autor:in)
SURFACE REVIEW AND LETTERS ; 14 ; 593-596
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
530.417
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