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    NXP System-in-Package Vision and Latest 3D Technology Developments

    New search for: Yannou, J.-M.
    New search for: Neuilly, F.
    New search for: Moreno, J.-A.
    New search for: Pommier, M.
    New search for: Bellenger, S.
    New search for: Biermans, P.

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    NXP System-in-Package Vision and Latest 3D Technology Developments

    New search for: Yannou, J.-M.
    New search for: Neuilly, F.
    New search for: Moreno, J.-A.
    New search for: Pommier, M.
    New search for: Bellenger, S.
    New search for: Biermans, P.

    Access

    Access via TIB
    Check availability in my library

    NXP System-in-Package Vision and Latest 3D Technology Developments

    New search for: Yannou, J.-M.
    New search for: Neuilly, F.
    New search for: Moreno, J.-A.
    New search for: Pommier, M.
    New search for: Bellenger, S.
    New search for: Biermans, P.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    NXP System-in-Package Vision and Latest 3D Technology Developments

    Contributors:

    Yannou, J.-M. (author) / Neuilly, F. (author) / Moreno, J.-A. (author) / Pommier, M. (author) / Bellenger, S. (author) / Biermans, P. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 34 ; 16-21

    Publication date:

    2007-01-01

    Size:

    6 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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