A platform for research: civil engineering, architecture and urbanism
The micro-impact fracture behavior of lead-free solder ball joints
The micro-impact fracture behavior of lead-free solder ball joints
The micro-impact fracture behavior of lead-free solder ball joints
Huang, Y.L. (author) / Lin, K.L. (author) / Liu, D.S. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1057-1063
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Fracture load prediction of lead-free solder joints
British Library Online Contents | 2010
|Effect of geometry on the fracture behavior of lead-free solder joints
British Library Online Contents | 2011
|Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
British Library Online Contents | 2014
|Mixed-mode fracture load prediction in lead-free solder joints
British Library Online Contents | 2011
|Thermomigration in lead-free solder joints
British Library Online Contents | 2008
|