Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Thermomigration in lead-free solder joints

    New search for: Abdulhamid, M.F.
    New search for: Li, S.
    New search for: Basaran, C.
    New search for: Ladani, L.J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Thermomigration in lead-free solder joints

    New search for: Abdulhamid, M.F.
    New search for: Li, S.
    New search for: Basaran, C.
    New search for: Ladani, L.J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermomigration in lead-free solder joints

    New search for: Abdulhamid, M.F.
    New search for: Li, S.
    New search for: Basaran, C.
    New search for: Ladani, L.J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermomigration in lead-free solder joints

    Contributors:

    Abdulhamid, M.F. (author) / Li, S. (author) / Basaran, C. (author) / Ladani, L.J.

    Published in:

    SPECIAL ISSUE: DAMAGE IN ELECTRONIC MATERIALS ; 11-34

    INTERNATIONAL JOURNAL OF MATERIALS AND STRUCTURAL INTEGRITY ; 2

    Publication date:

    2008-01-01

    Size:

    24 pages

    ISSN:

    1745-0055

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermomigration in lead-free solder joints

    Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal | British Library Online Contents | 2008

    Thermomigration in solder joints

    Chen, C. / Hsiao, H. Y. / Chang, Y. W. et al. | British Library Online Contents | 2012

    Low temperature electromigration and thermomigration in lead-free solder joints

    Basaran, C. / Abdulhamid, M. F. | British Library Online Contents | 2009

    Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

    Yang, D. | British Library Online Contents | 2008

    Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

    Chen, H.-Y. / Chen, C. | British Library Online Contents | 2011

    Back to top