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Enabling Next-generation Stacked-die Applications: Die-attach Technologies Improve Throughput

Todd, M. / Gupta, S. / Huneke, J.T.

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Enabling Next-generation Stacked-die Applications: Die-attach Technologies Improve Throughput

Todd, M. / Gupta, S. / Huneke, J.T.

Enabling Next-generation Stacked-die Applications: Die-attach Technologies Improve Throughput

Todd, M. / Gupta, S. / Huneke, J.T.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Enabling Next-generation Stacked-die Applications: Die-attach Technologies Improve Throughput

Contributors:

Todd, M. (author) / Gupta, S. (author) / Huneke, J.T. (author)

Published in:

ADVANCED PACKAGING ; 17 ; 33-34

Publication date:

2008-01-01

Size:

2 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

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