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The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Zhong, Y.S. / Shi, L.P. / Yu, J. / He, X.D.

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The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Zhong, Y.S. / Shi, L.P. / Yu, J. / He, X.D.

The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Zhong, Y.S. / Shi, L.P. / Yu, J. / He, X.D.

Access

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Check availability in my library

Order at Subito €

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Document information

Title:

The Effects of Substrate Temperature on the Residual Stress for EBPVD TBCs

Contributors:

Zhong, Y.S. (author) / Shi, L.P. (author) / Yu, J. (author) / He, X.D. (author) / Niu, J. / Liu, Z. / Jin, C. / Zhov, G.

Published in:

Physical and Numerical Simulation of Materials Processing ; 1276-1280

MATERIALS SCIENCE FORUM ; 575/578

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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