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    An analysis of thermal residual stresses in SiCf/Cu composites when TiC or Ni as binder

    New search for: Luo, X.
    New search for: Yang, Y.
    New search for: Li, J.
    New search for: Yuan, M.
    New search for: Huang, B.
    New search for: Chen, Y.

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    An analysis of thermal residual stresses in SiCf/Cu composites when TiC or Ni as binder

    New search for: Luo, X.
    New search for: Yang, Y.
    New search for: Li, J.
    New search for: Yuan, M.
    New search for: Huang, B.
    New search for: Chen, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    An analysis of thermal residual stresses in SiCf/Cu composites when TiC or Ni as binder

    New search for: Luo, X.
    New search for: Yang, Y.
    New search for: Li, J.
    New search for: Yuan, M.
    New search for: Huang, B.
    New search for: Chen, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    An analysis of thermal residual stresses in SiCf/Cu composites when TiC or Ni as binder

    Contributors:

    Luo, X. (author) / Yang, Y. (author) / Li, J. (author) / Yuan, M. (author) / Huang, B. (author) / Chen, Y. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 29 ; 1755-1761

    Publication date:

    2008-01-01

    Size:

    7 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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