Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Aspects on Advanced Thermal Management for Flip Chip on LTCC

    New search for: Noren, M.
    New search for: Brunner, S.
    New search for: Hoffmann, C.
    New search for: Salz, W.
    New search for: Aichholzer, K.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Aspects on Advanced Thermal Management for Flip Chip on LTCC

    New search for: Noren, M.
    New search for: Brunner, S.
    New search for: Hoffmann, C.
    New search for: Salz, W.
    New search for: Aichholzer, K.

    Access

    Access via TIB
    Check availability in my library

    Aspects on Advanced Thermal Management for Flip Chip on LTCC

    New search for: Noren, M.
    New search for: Brunner, S.
    New search for: Hoffmann, C.
    New search for: Salz, W.
    New search for: Aichholzer, K.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Aspects on Advanced Thermal Management for Flip Chip on LTCC

    Contributors:

    Noren, M. (author) / Brunner, S. (author) / Hoffmann, C. (author) / Salz, W. (author) / Aichholzer, K. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 35 ; 12-15

    Publication date:

    2008-01-01

    Size:

    4 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermal Conductivity of LTCC

    Geng, Z. T. / Ning, H. L. / Ma, J. S. et al. | British Library Online Contents | 2003

    Lithography for Advanced Packaging Flip chip and WLCSP applications

    Ranjan, M. / Kay, S. | British Library Online Contents | 2002

    Flip Chip Technologies

    British Library Online Contents | 2008

    Advanced moulding for advanced electronics: Amkor's improved flip chip packaging for electronic circuits

    British Library Online Contents | 2008

    Flip Chip BGA Assembly

    Kyu, A.-S. / Hua, D. J. / Li, C. Y. | British Library Online Contents | 2003

    Back to top