Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V: Fid-Bau Portal

Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V

Chen, C.-c. / Chen, S.-w. / Chang, C.-h.

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Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V

Chen, C.-c. / Chen, S.-w. / Chang, C.-h.

Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V

Chen, C.-c. / Chen, S.-w. / Chang, C.-h.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solid/solid interfacial reactions between Sn-0.7 wt% Cu and Ni-7 wt% V

Contributors:

Chen, C.-c. (author) / Chen, S.-w. (author) / Chang, C.-h. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1895-1901

Publication date:

2008-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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