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Enhanced tensile ductility in an electrodeposited nanocrystalline copper

Wang, G. / Jiang, Z. / Zhang, H. / Lian, J.

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Enhanced tensile ductility in an electrodeposited nanocrystalline copper

Wang, G. / Jiang, Z. / Zhang, H. / Lian, J.

Enhanced tensile ductility in an electrodeposited nanocrystalline copper

Wang, G. / Jiang, Z. / Zhang, H. / Lian, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Enhanced tensile ductility in an electrodeposited nanocrystalline copper

Contributors:

Wang, G. (author) / Jiang, Z. (author) / Zhang, H. (author) / Lian, J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2238-2244

Publication date:

2008-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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