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A platform for research: civil engineering, architecture and urbanism
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Hong, S.J. (author) / Park, B.-H. (author) / Seo, D.S. (author) / Ryu, C.-R. (author)
SURFACE ENGINEERING -LONDON- ; 24 ; 337-340
2008-01-01
4 pages
Article (Journal)
English
DDC:
620.44
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