Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films: Fid-Bau Portal

Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films

Simoes, S. / Calinas, R. / Ferreira, P.J. / Vieira, M.T. / Viana, F. / Vieira, M.F.

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Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films

Simoes, S. / Calinas, R. / Ferreira, P.J. / Vieira, M.T. / Viana, F. / Vieira, M.F.

Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films

Simoes, S. / Calinas, R. / Ferreira, P.J. / Vieira, M.T. / Viana, F. / Vieira, M.F.

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Title:

Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films

Contributors:

Simoes, S. (author) / Calinas, R. (author) / Ferreira, P.J. (author) / Vieira, M.T. (author) / Viana, F. (author) / Vieira, M.F. (author) / Marques, A.T. / Silva, A.F. / Baptista, A.P.M. / Sa, C.

Published in:

Advanced Materials Forum IV Selected, peer reviewed papers from the IV International Materials Symposium Materiais 2007 and XIII Encontro da Sociedade Portuguesa de Materiais - SPM, Faculdade de Engenharia da Universidade do Porto, April 1-4, Porto, Portugal, 2007 ; 483-487

MATERIALS SCIENCE FORUM ; 587/588

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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