Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine: Fid-Bau Portal

Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Li, L. / Yan, G. / Wu, J. / Yu, X. / Guo, Q. / Kang, E.

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Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Li, L. / Yan, G. / Wu, J. / Yu, X. / Guo, Q. / Kang, E.

Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Li, L. / Yan, G. / Wu, J. / Yu, X. / Guo, Q. / Kang, E.

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Check availability in my library

Order at Subito €

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Document information

Title:

Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Contributors:

Li, L. (author) / Yan, G. (author) / Wu, J. (author) / Yu, X. (author) / Guo, Q. (author) / Kang, E. (author)

Published in:

APPLIED SURFACE SCIENCE ; 254 ; 7331-7335

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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