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    Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

    New search for: Wang, W. C.
    New search for: Kang, E. T.
    New search for: Neoh, K. G.

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    Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

    New search for: Wang, W. C.
    New search for: Kang, E. T.
    New search for: Neoh, K. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

    New search for: Wang, W. C.
    New search for: Kang, E. T.
    New search for: Neoh, K. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

    Contributors:

    Wang, W. C. (author) / Kang, E. T. (author) / Neoh, K. G. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 199 ; 52-66

    Publication date:

    2002-01-01

    Size:

    15 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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