A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Electronic speckle pattern interferometry applied for three-dimensional displacement measurement of a sandwich plate containing a fully potted insert
Electronic speckle pattern interferometry applied for three-dimensional displacement measurement of a sandwich plate containing a fully potted insert
Electronic speckle pattern interferometry applied for three-dimensional displacement measurement of a sandwich plate containing a fully potted insert
Huang, S.-J. (author) / Yeh, H.-J. (author)
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 43 ; 645-654
2008-01-01
10 pages
Article (Journal)
English
DDC:
624.176
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