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Additive for Acidic Copper Plating

Liu, J.-f. / Peng, L.-f. / Liu, Y. / Li, X.-z.

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Additive for Acidic Copper Plating

Liu, J.-f. / Peng, L.-f. / Liu, Y. / Li, X.-z.

Additive for Acidic Copper Plating

Liu, J.-f. / Peng, L.-f. / Liu, Y. / Li, X.-z.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Additive for Acidic Copper Plating

Contributors:

Liu, J.-f. (author) / Peng, L.-f. (author) / Liu, Y. (author) / Li, X.-z. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 41 ; 40-41

Publication date:

2008-01-01

Size:

2 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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