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    Non-destructive Evaluation of Adhesive Bonding Using Reflective Fringe Pattern Technique

    New search for: Chan, F. W.
    New search for: Yeung, T. W.

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    Non-destructive Evaluation of Adhesive Bonding Using Reflective Fringe Pattern Technique

    New search for: Chan, F. W.
    New search for: Yeung, T. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Non-destructive Evaluation of Adhesive Bonding Using Reflective Fringe Pattern Technique

    New search for: Chan, F. W.
    New search for: Yeung, T. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Non-destructive Evaluation of Adhesive Bonding Using Reflective Fringe Pattern Technique

    Contributors:

    Chan, F. W. (author) / Yeung, T. W. (author)

    Published in:

    JOURNAL OF NONDESTRUCTIVE EVALUATION ; 27 ; 105-114

    Publication date:

    2008-01-01

    Size:

    10 pages

    ISSN:

    0195-9298

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.1127

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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